Morse Micro is at the forefront of next-generation Wi-Fi technology, specializing in Wi-Fi HaLow solutions that offer extended range, lower power consumption, and enhanced penetration. Our innovative chipset applications are designed to revolutionize connectivity for a variety of applications, including IoT, smart home, and industrial automation. Job Summary: Morse Micro is seeking a Product Quality Engineer to join the Failure Analysis (FA) lab at the Irvine site and grow into serving as a point of contact between customers, Field Application Engineers (FAEs), and Sydney-based engineering teams (Design, Systems, Radio, DVT, Firmware). All customer-returned defective units are received, triaged, and investigated at Irvine. This is an early-career role: you'll be mentored by senior FA and quality engineers in Irvine and Sydney as you build toward full ownership of the lab and customer relationships. The candidate must be capable of hands-on module-level RF testing and failure triage, translate findings into clear FA reports, and collaborate with senior engineers to drive investigations to closure through disciplined cross-time zone coordination with remote engineering teams. Early Career - New Grad or 2–3 Years Experience Key Responsibilities Hands-On FA Lab Execution - Receive, log, and maintain chain-of-custody for all customer-returned units (bare modules and end-devices); manage sample tracking from receipt through investigation completion. Units are retained at Morse Micro after FA. - Operate the Irvine production lab (LitePoint IQxel + FW) to run full Tx/Rx RF test suites on FA units measuring Tx power, EVM, SEM, PER, and frequency error across MCS/BW/frequency combinations, and flash firmware branches from the Systems/Radio teams to execute structured before/after corrective action verification. - Perform systematic multi-unit failure triage using the module test jig: power-on behavior assessment, chip serial logging, failure mode classification, and Jira ticket creation. - Conduct component-level fault isolation as needed to isolate whether failures originate at the chip or PCB level, with support from senior engineers on complex cases. Customer Communication & FA Report Delivery - Support customer-facing communication for FA cases, acknowledging receipt, setting timelines, and providing data-backed status updates throughout the investigation lifecycle, growing into independent ownership of this over time. - Prepare and issue FA Reports (FARs) to customers (with senior review initially), technically accurate, clearly communicating root cause, corrective action, and verification evidence. - Respond to FAE and customer technical inquiries, translating ongoing lab findings into clear, timely communication appropriate for both technical and non-technical contacts. Cross-Time Zone Coordination with Engineering Teams - Work alongside senior engineers as an Irvine-side technical liaison to Design, Systems, Radio, DVT, and Firmware teams, translating lab findings into structured technical briefs and working with FAEs to provide full customer application context that remote engineers can act on asynchronously. - Maintain Jira FA tickets with complete technical details, test configurations, firmware versions, BCF files, per-unit results, and failure evidence so remote teams can pick up full context without a live handoff. - Support firmware branch requests, root cause assignments, and corrective action commits; follow up proactively to prevent stalls, with increasing independence as you gain experience. - Facilitate cross-site FA review calls (initially alongside a senior engineer): preparing agendas, presenting lab findings, capturing action items, and tracking commitments to closure. Investigation Documentation & Reporting - Document all lab test procedures, results, and configurations in Confluence, ensuring investigations are fully reproducible, auditable, and accessible to remote engineering teams. - Prepare internal FA summary reports covering failure pareto, repeat failure patterns, and corrective action verification results for engineering review and management visibility. Qualifications Required - Hands-on RF production test experience (or equivalent academic/lab/thesis experience) operating LitePoint IQxel or equivalent, running Tx/Rx test suites, flashing firmware builds, configuring BCF/test region settings, and executing before/after comparisons for corrective action verification. - Understanding of or exposure to module-level failure triage concepts: power-on jig assessment, chip serial logging, multi-category failure classification, and Jira-based tracking with engineering team routing. - Willingness and aptitude to grow into owning customer FA investigations end-to-end, from unit receipt through root cause, corrective action verification, and FA Report delivery. - Strong technical writing skills: clear customer-facing FA reports and structured internal investigation documents. - Effective cross-time zone communication; interest in or experience working with distributed engineering teams, with a disciplined async-first, Jira/Confluence documentation approach. - Education: Bachelor’s degree in electrical engineering, RF/Microwave Engineering, or a related field with 2–3 years of relevant experience; OR a Master's degree in Electrical Engineering, RF/Microwave Engineering, Wireless Communications, or a related field with graduate coursework or research in RF circuit design, antenna theory, wireless systems, or analog IC design. Preferred - Familiarity with Wi-Fi HaLow (IEEE 802.11ah), Wi-Fi, or similar RF/wireless semiconductor products e.g., through coursework in RF/microwave circuits, antenna theory, wireless communications, analog IC design, electromagnetics, or digital signal processing sufficient to understand customer failure context and configure a basic test network for reproduction. - Experience with MFT (Manufacturing Firmware Test) or similar production test software for module-level test execution and data collection. - Experience in a fabless semiconductor company with OSAT-based manufacturing and a global customer base. Who we are: Morse Micro is Australia’s largest semiconductor company building Wi-Fi HaLow (802.11ah) chips for the Internet of Things (IoT). We are a team of wireless experts that love to work hard, innovate & invent. Together, we are building the world’s lowest power Wi-Fi technology that will enable billions of IoT devices to connect securely to the internet. We are a global team with offices in Sydney, Picton & Melbourne (Australia), Irvine & San Jose (USA), Bangalore (India), Cambridge (UK), Hangzhou & Shenzen (China), Taipei (Taiwan) and Tokyo (Japan).